Argonne National Laboratory

 

CNM Short Courses   Thursday, May 5, 2011

Please note that each course has a maximum attendance limit. Requests received after the course has filled will be placed on a wait list.  These courses are quite technical and geared for serious potential future users.

A: Electron Beam Lithography (Maximum of 10 attendees)
B: Synthesis and characterization of Nanocarbon Materials (Maximum of 15 attendees)
C: Introduction to Using the CNM Computing Cluster for Materials Modeling (Maximum of 22 attendees)
D: Focused Ion Beam Lithography (Maximum of 8 attendees)
E: Introduction to Sputtering and PECVD Techniques (Maximum of 10 attendees)
F: Fundamentals of Pattern Transfer (Maximum of 8 attendees)
G: Fundamentals of Atomic Layer Deposition (Maximum of 22 attendees) 

 

Morning Session: 8:30 am - 12:00 pm

A: Electron Beam Lithography   - This Short Course is full.  Only wait list registrations are accepted.
Instructor:  Leo Ocola
Second Floor Gallery
 
The advanced JEOL 9300FS 100-keV electron beam lithography system reproducibly achieves feature sizes below 10 nm. This state-of-the-art-tool has a 1-nm address grid over a complete 1-mm field size. Pattern placement errors are in the single-digit nanometers. The system can handle samples from small pieces to 8-inch wafers. We will demonstrate the use of the JEOL 9300 and perform SEM inspection of an exposed pattern using a Raith 150 electron beam lithography instrument. 
(Maximum of 10 attendees)
 
B: Synthesis and characterization of Nanocarbon Materials - This Short Course is full.  Only wait list registrations are accepted.
Instructor:  Ani Sumant
Room A201
 
This course will describe synthesis capabilities at CNM in the nanocarbon area including the Lambda 915-MHz microwave plasma chemical vapor deposition system for the synthesis of diamond films and Atomate's Thermal/PECVD system for carbon nanotube and Graphene synthesis. The course is designed to understand the synthesis process of different forms of nanocarbon materials such as nanocrystalline and ultrananocrystalline diamond thin films as well as carbon nanotubes and Graphene. Various characterization methods will also be discussed. In addition, this course will highlight basic micro/nano fabrication techniques in fabricating carbon-based MEMS and NEMS.
(Maximum of 15 attendees)
 
C: Introduction to Using the CNM Computing Cluster for Materials Modeling - This Short Course is full.  Only wait list registrations are accepted.
Instructors:  Michael Sternberg and  Anders Blom (QuantumWise, A/S)
Room A105/106
 
This course will provide an introduction to the CNM high-performance computing cluster, covering capabilities and available applications. We will give an overview on materials modeling and visualization techniques.
 
The main part of the talk will focus on ATK, a software platform developed by QuantumWise for atomic-scale transport simulations, and how its functionality is being extended into the area of surface electrochemistry. Recently added capabilities includes engines for classical molecular dynamics and Socorro, a parallelized density-functional theory code (developed at Sandia) with support for time-dependent DFT.
 
We will demonstrate how a graphical user interface can reduce the barrier for e.g. experimentalists to get started using state-of-the-art atomic-scale modeling codes like Atomistix ToolKit for electronic transport calculations, and GPAW (co-developed at Argonne) for applications in catalysis. We will also discuss possibilities for non-equillibrium transport models to study the effects of bias on chemical reaction rates and pathways on surfaces.
(Maximum of 40 attendees)
 
 

Afternoon Session: 1:30 pm - 5:00 pm

D: Focused Ion Beam Lithography - This Short Course is full.  Only wait list registrations are accepted.
Instructor:  Il Woong Jung
Second Floor Gallery
 
Both for beginner and for experienced focused-ion-beam users, this course will introduce patterning capabilities on our FEI Nova NanoLab Dual Beam instrument. This tool integrates ion and electron beams in one machine, providing quick and accurate navigation and processing. Several gas injection systems are available for ion-beam-induced chemical vapor deposition in addition to the basic ion-beam milling feature. For complex lithography needs, a Raith lithography system is installed that enables GDS file exposure and alignment to existing patterns.
(Maximum of 8 attendees)
 
E: Introduction to Sputtering and PECVD Techniques - This Short Course is full.  Only wait list registrations are accepted.
Instructors:  David Czaplewski, Liliana Stan
Room A201
 
This course will provide an overview of two different vapor deposition techniques available at the CNM, physical sputtering and chemical vapor deposition. We will provide a description of the sputtering and chemical vapor deposition tools and their capabilities. We will discuss the influence of process parameters on the properties of the deposited films. We will proceed into the cleanroom, where the group will be divided into two and a film deposition will be demonstrated in each tool for both groups.
(Maximum of 10 attendees)
 
F: Fundamentals of Pattern Transfer - This Short Course is full.  Only wait list registrations are accepted.
Instructor: Ralu Divan
Room A215
 
This course will discuss and demonstrate the pattern transfer by wet etch and dry etch (reactive ion etching). The applications of these processes are the chemical transfer of 2D patterns in thin films and substrates and the micro- and nanofabrication of 3D structures in substrates. This course will present a comparison between wet etching and dry etching and will include a demonstration of the capabilities of the CNM’s etching tools.
(Maximum of 8 attendees)
 
 
G: Fundamentals of Atomic Layer Deposition - This Short Course is full.  Only wait list registrations are accepted.
Instructor:  Jeffrey Elam
Room A105/106
 
This class will be an introduction to atomic layer deposition (ALD) thin film coating technology.  We will start by reviewing the fundamentals of self-limiting surface chemistry that underlie ALD.  Next we will survey the range of ALD materials and the processes used to deposit these materials.  We will then talk about ALD equipment with some emphasis on the CNM tool.  Finally, we will look at applications of ALD films in microelectronics and nanotechnology.
(Maximum of 40 attendees)
 

 

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